Power-effective thermoelectric semiconductor heat rejection for computer processors
https://doi.org/10.21822/2073-6185-2020-47-3-8-15
Abstract
Objective. The article deals with heat removal from computer processors in order to provide the necessary thermal conditions and temperature control of heat-generating components on integrated circuits. Methods. Methods for modeling heat exchange processes during heat transfer from a heated integral crystal to the environment are applied. Results. The power efficiency of heat rejection processors increases when using radiating thermoelectric semiconductor devices since heat is absorbed in some junctions, and instead of generating heat photons of the ultraviolet range are emitted to obtain better energy characteristics to ensure the necessary power removal from the heatgenerating components of radio-electronic circuits. This approach has a significant advantage as radiation has the maximum speed when transferring energy compared to convection and conduction, which allows for non-inertial heat removal from heat-generating components to the environment. This approach also allows increasing the efficiency of the cooling system and accelerating the transfer of heat from the heated areas to prevent heat breakdown. Conclusion. The conducted research allows concluding that light-emitting thermoelectric semiconductor devices can be used for cooling with high power efficiency, which can transfer large amounts of power to the environment with low inertia. An innovative cooling system for computer processors allows increasing the degree of integration by several orders of magnitude, which will increase the performance of computers and their speed.
About the Authors
T. A. Ismailov
Daghestan State Technical University
Russian Federation
Russian Federation
Tagir A. Ismailov - Dr. Sci. (Technical), Prof., Department of Theoretical and General electrical Engineering. Honored Worker of Science of the Russian Federation, President DSTU.
70 I. Shamilya Ave., Makhachkala 367026.
H. M. Gadjiev
Daghestan State Technical University
Russian Federation
Russian Federation
Hadzhimurat M. Gadzhiev - Cand.Sci (Technical), Assoc. Prof., Department of Radio Engineering, Telecommunications and Microelectronics.
70 I. Shamilya Ave., Makhachkala 367026.
A. M. Ibragimova
Daghestan State Technical University
Russian Federation
Russian Federation
Asiyat M. Ibragimova - Аpplicant, Department of Theoretical and General Electrical Engineering.
70 I. Shamilya Ave., Makhachkala 367026.
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For citations:
Ismailov T.A., Gadjiev H.M., Ibragimova A.M. Power-effective thermoelectric semiconductor heat rejection for computer processors. Herald of Dagestan State Technical University. Technical Sciences. 2020;47(3):8-15. (In Russ.) https://doi.org/10.21822/2073-6185-2020-47-3-8-15
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