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ENSURING THERMAL REGIME FOR THE SUPPLY DISTRIBUTED DEVICES IN THE COMPOSITION OF THE SHIP'S SECONDARY POWER SUPPLY SYSTEMS ON THE BASE OF THE STANDARDIZED UNITS

https://doi.org/10.21822/2073-6185-2016-42-3-64-72

Abstract

Aim. The article deals with the problem of constructing the power supply devices in the composition of the ship's secondary power systems based on standardized blocks and securing their thermal regime.

Methods. It is stated that with the advent of modern power electronics multifunctional components the secondary power supply developers got possibilities to improve the quality of secondary power supply and to upgrade the existing systems.

Results. The advantages of unified power units, having a function of parallel operation are revealed. Heat transfer processes in a vertical channel with free convection, and the calculation of the minimum width of the channel, which provides efficient heat removal have been analyzed.

Conclusion.A model is proposed for determining the minimum distance between the blocks without deterioration of heat transfer in the channel formed by the walls of adjacent blocks.

About the Authors

T. A. Ismailov
Daghestan State Technical University
Russian Federation

doctor of technical Sciences, Professor, head of Department of theoretical and General electrical engineering, the rector, Honored worker of science of the Russian Federation

 70 I. Shamil Ave, Makhachkala, 367015



E. M. Muslimov
Caspian float plant of precision mechanics
Russian Federation

chief designer of JSC, area of scientific interests – Development of ship navigation systems and power supplies,

24 Khizroeva, street, Kaspiysk



A. T. Rashidkhanov
Daghestan State Technical University
Russian Federation

graduate student,

 70 I. Shamil Ave, Makhachkala, 367015



Sh. A. Yusufov
Daghestan State Technical University
Russian Federation

candidate of technical Sciences, Аssociate Professor, Department of theoretical and General electrical engineering,

 70 I. Shamil Ave, Makhachkala, 367015



References

1. Sarkis E., Joseph M. Problems of development and selection of standard units and blocks of secondary power supply for electronics navy. Power electronics, 2012, no.3, pp.15-25, no.4, pp. 40-46.(In Russian)

2. Vats l. Sources of supply of ready-made components and modules. Electronic components. 2006, no. 2, pp. 39-44. (In Russian)

3. Zeitin A., Domestic sources of power-the new generation. Electronic components. 2008, no.8, pp.132-133. (In Russian)

4. Shalumov A.S., Kulikov O.E. Analysis and maintenance methodology efficiency of shielding of designs of electronic equipment on the basis of numerical modelling of electromagnetic processes. European journal of natural history. 2013, no 5, pp.23- 24.

5. Shalumov E., Pershin А., Korkin V., Accelerated Simulation of Thermal and Mechanical Reliability of Electronic Devices and Circuits. Example of an integrated circuit simulation in ASONIKA-M-3D. Dinamika slozhnykh sistem. 2013, no.5, pp.59-67.

6. Shalumov, E. Pershin. Accelerated Simulation of Thermal and Mechanical Reliability of Electronic Devices and Circuits. Moscow: Printing by PrintLETO.ru, 2013, 128 p.

7. Drofenik U. Analysis of Theoretical Limits of Forced-Air Cooling Using Advanced Composite Materials With High Thermal Conductivities U. Drofenik, A. Stupar, J.W. Kolar. IEEE Transactions on Components, Packaging, and Manufacturing Technology. 2011, vol.1, no.4, pp.528–535.

8. Gaponenko N.P., Sirotyuk O.V., Ogrenich E.V., Lopatka Yu. A., Areshkin E. K. Optimization of the volume of sealed electronics units. Prikladnaya radioelektronika. 2012, vol.11, no.3, pp. 55-158. (In Russian)

9. Fabbri M., Dhir V., Optimized heat transfer for high power electronic cooling using arrays of microjets. J. of Heat Transfer, vol. 127, pp. 760-769.

10. Pan P., Webb B. W. Heat transfer characteristics of arrays of free-surface liquid Jets. J. of Heat Transfer, vol. 117, pp.878-883.

11. Lin L. Ponnappan R. Heat transfer characteristics of spray cooling in a closed loop. Int. J. of Heat and Mass Transfer, vol. 46, pp.3737–3746.

12. Yonglu Liu. Experimental research on a honeycomb microchannel cooling system. Yonglu Liu, Xiaobing Luo, Wei Liu.Transactions on components, packaging and manufacturing technology, 2011, vol.1, no.9, pp.1378 –1986.

13. Yifeng Fu, Nabi Nabiollahi, Teng Wang, Shun Wang, Zhili Hu, BjörnCarlberg, Yan Zhang, Xiaojing Wang, Johan Liu. A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity. Nanotechnology. 2012, vol. 23, no.4.

14. Korablev V.A., Pavlov D.A. Free-convective cooling tion of electronic equipment arranged in the standard basic load-bearing structures.Collection of papers of the III scientific-technical conference of young specialists on electronics. Saint Petersburg: AGRAF+, 2010, pp. 58-61(In Russian)

15. Gebhart B., Dzhaluriya I., Mahajan R., Sammak B. Free-convective TE cheniya, heat and mass transfer. Book. Moscow: Mir, 1991, 678 p. (In Russian)

16. Dulnev G.N., Parfenov V.G, Sigalov A.V. Methods for calculating the thermal regime of devices. Moscow: RADIO I SVYAZ', 1990, 312 p. (In Russian)

17. Kondratyev G.M., Dulnev G.N., Platunov E.S., Yaryshev N.A. Applied physics: Heat transfer in instrumentation. St. Petersburg: SPbGUITMO, 2003, 560 p. (In Russian)

18. Pavlov A.D. Heat transfer processes in the radio-electronic devices in sealed design. Thesis for scientific degree of candidate of technical sciences. Sankt-Peterburgskii gosudarstvennyi universitet informatsionnykh tekhnologii, mekhaniki i optiki [Saint-Petersburg State University of Information Technologies, Mechanics and Optics], 2011, 113 p. (In Russian)

19. Dulnev G.N. Fluid Mechanics: Textbook. St. Petersburg: SPbGITMO (TU), 2001, 188 p. (In Russian)

20. Martynenko O.G., Sokovishin Yu. Free-convective heat transfer: A Handbook. Minsk: Nauka i tekhnika, 1982, 400 p. (In Russian)


Review

For citations:


Ismailov T.A., Muslimov E.M., Rashidkhanov A.T., Yusufov Sh.A. ENSURING THERMAL REGIME FOR THE SUPPLY DISTRIBUTED DEVICES IN THE COMPOSITION OF THE SHIP'S SECONDARY POWER SUPPLY SYSTEMS ON THE BASE OF THE STANDARDIZED UNITS. Herald of Dagestan State Technical University. Technical Sciences. 2016;42(3):64-72. (In Russ.) https://doi.org/10.21822/2073-6185-2016-42-3-64-72

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ISSN 2073-6185 (Print)
ISSN 2542-095X (Online)